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15 kv esd protected, 2.7 v to 3.6 v serial port transceivers with green idle? adm3307e/adm3310e/adm3311e/adm3312e/adm3315e 1 rev. h information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ?2006 analog devices, inc. all rights reserved. features green idle power-saving mode single 2.7 v to 3.6 v power supply operates with 3 v logic 0.1 f to 1 f charge pump capacitors low emi low power shutdown: 20 na full rs-232 compliance 460 kb/s data rate one receiver active in shutdown (adm3307e/adm3311e/adm3312e/adm3315e) two receivers active in shutdown (adm3310e) esd >15 kv iec 1000-4-2 on rs-232 i/os esd >15 kv iec 1000-4-2 on cmos and rs-232 i/os (adm3307e) applications mobile phone handsets/data cables laptop and notebook computers printers peripherals modems pdas/hand-held devices/palmtop computers functional block diagrams v cc r1 out t5 in t4 in t1 in t1 out t3 in t2 in adm3307e sd v+ c1+ c1? c2? v? c3+ v cc gnd c2 c3? c2+ c1 0.1f 0.1f r2 out r3 out t2 out t3 out t4 out t5 out r1 in r2 in r3 in 0.1f ceramic 10f tantalum + c4 0.1f shutdown input enable input cmos inputs 1 cmos outputs en voltage tripler/ inverter +3v to 9v c3 0.1f c5 0.1f eia/tia-232 outputs eia/tia-232 inputs 2 t1 t3 t2 t5 t4 r3 r1 r2 1 internal 400k ? pull-up resistor on each cmos input. 2 internal 5k ? pull-down resistor on each rs-232 input. 02915-001 figure 1. adm3307e functional block diagram v cc t1 in t1 out t3 in t2 in adm3310e/ adm3311e c1+ v+ c3? c2? v cc c1? gnd c2+ sd v? c3+ c1 0.1f t2 out t3 out 0.1f ceramic 10f tantalum + c4 0.1f c2 0.1f enable input shutdown input cmos inputs 1 cmos outputs en voltage tripler/ inverter +3v to 9v c3 0.1f c5 0.1f eia/tia-232 outputs eia/tia-232 inputs 2 r1 out r1 in r1 r3 out r3 in r3 r2 out r2 in r2 r5 out r5 in r5 r4 out r4 in r4 t3 t1 t2 1 internal 400k ? pull-up resistor on each cmos input. 2 internal 5k ? pull-down resistor on each rs-232 input. 02915-002 v cc t1 in t1 out t3 in t2 in adm3312e/ adm3315e c1+ v+ c3? c2? v cc c1? gnd c2+ sd v? c3+ c1 0.1f t2 out t3 out 0.1f ceramic 10f tantalum + c4 0.1f c2 0.1f enable input shutdown input cmos inputs 1 en voltage tripler/ inverter +3v to 9v c3 0.1f c5 0.1f cmos outputs eia/tia-232 outputs eia/tia-232 inputs 2 r1 out r1 in r3 out r3 in r2 out r2 in r1 r3 r2 t3 t1 t2 1 internal 400k ? pull-up resistor on each cmos input. 2 internal 5k ? (22k ? for adm3315e) pull-down resistor on each rs-232 input. 02915-003 figure 2. adm3310e/adm3311e functional block diagram figure 3. adm3312e/adm3315e functional block diagram 1 protected by u.s. patent no. 5,606,491.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 2 of 24 table of contents features .............................................................................................. 1 applications....................................................................................... 1 functional block diagrams............................................................. 1 revision history ............................................................................... 2 general description ......................................................................... 3 specifications..................................................................................... 4 absolute maximum ratings............................................................ 6 esd caution.................................................................................. 6 product selection guide .................................................................. 7 pin configurations and function descriptions ............................8 typical performance characteristics ........................................... 10 circuit description......................................................................... 13 enable and shutdown ................................................................ 15 layout and supply decoupling ................................................ 15 esd/eft transient protection scheme .................................. 15 esd testing (iec 1000-4-2) ..................................................... 16 outline dimensions ....................................................................... 18 ordering guide .......................................................................... 20 revision history 1/06rev. g to rev. h updated formatting................................................................. universal updated outline dimensions..............................................................18 changes to ordering guide .................................................................20 4/04rev. f to rev. g changes to ordering guide ................................................................... 5 updated outline dimensions..............................................................15 8/02rev. e to rev. f adm3307e (rev. 0), adm3311e (rev. e), and adm3312e (rev. a) data sheets merged into rev. g of adm33xxe. universal adm3310e (rev. pra now prelims) and adm3315e (rev. pra) added .................................................................... universal edits to features....................................................................................... 1 edits to applications ............................................................................... 1 edits to general description ................................................................. 1 edits to functional block diagrams ..................................................... 2 edits to specifications ............................................................................... edits to absolute maximum ratings .................................................... 4 adm33xx product select ion guide added ........................................ 5 added adm3307e, adm3310e, adm3312e, and adm3315e pin conf igurations ............................................................6 edits to pin function descriptions .......................................................7 added adm3307e, adm3310e, adm3312e, and adm3315e truth tables .......................................................................7 edits to tpcs 1C14 ..................................................................................8 tpcs 15C18 deleted..............................................................................10 edits to circuit desc ription section ...................................................11 edits to charge pump dc-to-dc voltage converter section........11 edits to how does it work section ....................................................11 edits to green idle vs. shutdown section ..........................................12 edits to doesnt it increase supply voltage ripple? section............12 edits to what about electromagnetic compatibility? section.......12 edits to transmitter (driver) section .................................................12 edits to receiver section ......................................................................12 edits to enable and shutdown section ...............................................12 edits to high baud rate section..........................................................13 edits to esd/eft transient protection scheme ...............................13 added figures 8a and 8b and renumbered the figures that followed ..........................................................................................13 edits to esd testing (iec 1000-4-2) section ....................................14 edits to figure 9 .....................................................................................14 deleted table ii and table iii and replaced them with table v .....14 added ru-24 package outline updated cp-32, rs-28 and ru-28...............................................................................................15
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 3 of 24 general description the adm33xxe line of driver/receiver products is designed to fully meet the eia-232 standard while operating with a single 2.7 v to 3.6 v power supply. the devices feature an on-board charge pump dc-to-dc converter, eliminating the need for dual power supplies. this dc-to-dc converter contains a voltage tripler and a voltage inverter that internally generates positive and negative supplies from the input 3 v power supply. the dc- to-dc converter operates in green idle mode, whereby the charge pump oscillator is gated on and off to maintain the output voltage at 7.25 v under varying load conditions. this minimizes the power consumption and makes these products ideal for battery-powered portable devices. the adm33xxe devices are suitable for operation in harsh electrical environments and contain esd protection up to 15 kv on their rs-232 lines (adm3310e, adm3311e, adm3312e, and adm3315e). the adm3307e contains esd protection up to 15 kv on all i/o lines (cmos, rs-232, en , and sd). a shutdown facility that reduces the power consumption to 66 nw is also provided. while in shutdown, one receiver remains active (two receivers active with adm3310e), thereby allowing monitor- ing of peripheral devices. this feature allows the device to be shut down until a peripheral device begins communication. the active receiver can alert the processor, which can then take the adm33xxe device out of the shutdown mode. the adm3307e contains five drivers and three receivers and is intended for mobile phone data lump cables and portable computing applications. the adm3311e contains three drivers and five receivers and is intended for serial port applications on notebook/laptop computers. the adm3310e is a low current version of the adm3311e. this device also allows two rece ivers to be active in shutdown mode. the adm3312e contains three drivers and three receivers and is intended for serial port applications, pdas, mobile phone data lump cables, and other hand-held devices. the adm3315e is a low current version of the adm3312e, with a 22 k receiver input resistance that reduces the drive requirements of the dte. its main applications are pdas, palmtop computers, and mobile phone data lump cables. the adm33xxe devices are fabricated using cmos technology for minimal power consumption. all parts feature a high level of overvoltage protection and latch-up immunity. all adm33xxe devices are available in a 32-lead 5 mm 5 mm lfcsp_vq and in a tssop (adm3307e, adm3310e, and adm3311e in a 28-lead tssop; adm3312e and adm3315e in a 24-lead tssop). the adm3311e also comes in a 28-lead ssop. the adm33xxe devices are ruggedized rs-232 line drivers/receivers that operate from a single supply of 2.7 v to 3.6 v. step-up voltage converters coupled with level shifting transmitters and receivers allow rs-232 levels to be developed while operating from a single supply. features include low power consumption, green idle operation, high transmission rates, and compatibility with the eu directive on electromag- netic compatibility. this em compatibility directive includes protection against radiated and conducted interference, including high levels of electrostatic discharge. all rs-232 (and cmos, sd, and en for adm3307e) inputs and outputs are protected against electrostatic discharges (up to 15 kv). this ensures compliance with iec 1000-4-2 requirements. these devices are ideally suited for operation in electrically harsh environments or where rs-232 cables are frequently being plugged/unplugged. they are also immune to high rf field strengths without special shielding precautions. emissions are also controlled to within very strict limits. cmos technology is used to keep the power dissipation to an absolute minimum, allowing maximum battery life in portable applications.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 4 of 24 specifications v cc = 2.7 v to 3.6 v, c1 to c5 = 0.1 f. all specifications t min to t max , unless otherwise noted. table 1 parameter min typ max unit test conditions/comments operating voltage range 2.7 3.3 3.6 v v cc power supply current adm3307e 0.75 1.5 ma v cc = 3.0 v to 3.6 v; no load 0.75 4.5 ma v cc = 2.7 v to 3.6 v; no load adm3311e, adm3312e 0.45 1 ma no load; v cc = 3.0 v to 3.6 v; t a = 0c to 85c 0.45 4.5 ma no load; v cc = 2.7 v to 3.6 v; t a = ? 40c to +85c adm3310e, adm3315e 0.35 0.85 ma v cc = 2.7 v to 3.6 v; no load adm3310e, adm3311e, adm3312e, adm3315e 35 ma r l = 3 k to gnd on all t outs shutdown supply current 0.02 1 a input pull-up current 10 25 a t in = gnd input leakage current, sd, en 0.02 1 a input logic threshold low, v inl 0.8 v t in , en , shdn 0.4 v t in , en , shdn; v cc = 2.7 v input logic threshold high, v inh 2.0 v t in , en , shdn cmos output voltage low, v ol 0.4 v i out = 1.6 ma cmos output voltage high, v oh v cc ? 0.6 v i out = ?200 a cmos output leakage current adm3307e 0.04 1 a en = v cc , 0 v < r out < v cc adm3310e, adm3311e 0.05 5 a en = v cc , 0 v < r out < v cc adm3312e, adm3315e charge pump output voltage, v+ +7.25 v no load adm3307e, adm3311e, adm3312e charge pump output voltage, v? ?7.25 v no load adm3307e, adm3311e, adm3312e charge pump output voltage, v+ +6.5 v no load adm3310e, adm3315e charge pump output voltage, v? ?6.5 v no load adm3310e, adm3315e eia-232 input voltage range ?25 +25 v eia-232 input threshold low 0.4 1.3 v eia-232 input threshold high 2.0 2.4 v eia-232 input hysteresis 0.14 v eia-232 input resistance adm3307e, adm3310e, adm3311e, adm3312e 3 5 7 k adm3315e 14 22 31 k output voltage swing adm3310e, adm3315e 5.0 5.5 v all transmit ter outputs loaded with 3 k to ground adm3307e, adm3311e, adm3312e 5.0 6.4 v v cc = 3.0 v 5.5 v v cc = 2.7 v all transmitter outputs loaded with 3 k to ground transmitter output resistance 300 v cc = 0 v, v out = 2 v rs-232 output short-circuit current 15 60 ma
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 5 of 24 parameter min typ max unit test conditions/comments maximum data rate adm3307e 250 720 kbps r l = 3 k to 7 k, c l = 50 pf to 1000 pf, v cc = 2.7 v 460 920 kbps r l = 3 k to 7 k, c l = 50 pf to 1000 pf, v cc = 3.0 v adm3310e, adm3311e, adm3312e, adm3315e 250 460 kbps r l = 3 k to 7 k, c l = 50 pf to 1000 pf, v cc = 3.0 v receiver propagation delay, t phl , t plh 0.3 s c l = 150 pf 0.17 1 s c l = 150 pf; adm3307e only receiver output enable time, t er 100 ns receiver output disable time, t dr 300 ns transmitter propagation delay, t phl , t plh 500 ns r l = 3 k, c l = 1000 pf transition region slew rate 3 18 v/s r l = 3 k, c l = 50 pf to 1000 pf 1 esd protection (i/o pins) 15 kv human body model 15 kv iec 1000-4-2 air discharge 8 kv iec 1000-4-2 contact discharge 2 1 measured at +3 v to ?3 v or ?3 v to +3 v. 2 includes cmos i/o, sd, and en for adm3307e.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 6 of 24 absolute maximum ratings t a = 25c, unless otherwise noted. table 2 parameter rating v cc ?0.3 v to +4 v v+ (v cc ? 0.3 v) to +9 v v? +0.3 v to ?9 v input voltages t in ?0.3 v to +6 v r in 30 v output voltages t out 15 v r out ?0.3 v to (v cc + 0.3 v) short-circuit duration t out continuous thermal impedance, ja lfcsp_vq (cp-32-2) 32.5c/w tssop (ru-28) 68.0c/w tssop (ru-24) 68.0c/w ssop (rs-28) 76.0c/w operating temperature range industrial (a version) ?40c to +85c storage temperature range ?65c to +150c lead temperature (soldering, 10 sec) 300c esd rating (iec 1000-4-2 air) (rs-232 i/os) 15 kv esd rating (iec 1000-4-2 contact) (rs-232 i/os) 8 kv stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. esd caution esd (electrostatic discharge) sensitive device. electros tatic charges as high as 4000 v readily accumulate on the human body and test equipment and can discharge wi thout detection. although this product features proprietary esd protection circuitry, permanent dama ge may occur on devices subjected to high energy electrostatic discharges. therefore, proper esd precautions are recommended to avoid performance degrada- tion or loss of functionality.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 7 of 24 product selection guide table 3. product selection guide generic supply voltage tx rx no. rx active in sd speed 15 kv esd i cc max i cc shutdown max 1 additional features adm3307e 2.7 v to 3.6 v 5 3 1 1 mbps rs-232 cmos, en , and sd 1.5 ma 1 a 15 kv esd protection, cmos on rs-232, and cmos i/os including sd and en pins adm3310e 2.7 v to 3.6 v 3 5 2 460 kbps rs-232 0.85 ma 1 a 2 rxs active in shutdown, green idle mode level 6 v, low power adm3311e adm3311e 2.7 v to 3.6 v 3 5 1 460 kbps rs-232 1 ma 1 a adm3312e 2.7 v to 3.6 v 3 3 1 460 kbps rs-232 1 ma 1 a adm3315e 2.7 v to 3.6 v 3 3 1 460 kbps rs-232 0.85 ma 1 a 22 k rx i/p resistance, green idle mode level 6 v, low power adm3312e 1 i cc shutdown is 20 na typically.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 8 of 24 pin configurations and function descriptions pin 1 indicator nc = no connect 1 en 2 sd 3 nc 4 t 1 in 5 t 2 in 6 t 3 in 7 t 4 in 8 t 5 in 24 v? 23 gnd 22 gnd 21 t1 out 20 t2 out 19 t3 out 18 t4 out 17 t5 out 9 n c 1 0 r 1 o u t 1 1 r 2 o u t 1 2 r 3 o u t 1 3 n c 1 4 r 3 i n 1 5 r 2 i n 1 6 r 1 i n 3 2 c 1 ? 3 1 c 2 ? 3 0 v c c 2 9 v + 2 8 c 2 + 2 7 c 3 + 2 6 c 1 + 2 5 c 3 ? top view (not to scale) adm3307e 0 2915-004 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 v cc c2? c1? t1 in sd en v+ c3+ c1+ c3? t1 out gnd v? t2 in t3 in t4 in r3 out r1 out t5 in t2 out t3 out t4 out r3 in r2 out r2 in r1 in t5 out c2+ adm3307e top view (not to scale) 02915-005 figure 4. adm3307e lfcsp_vq pin configuration figure 5. ssop/tssop pin configuration pin 1 indicator nc = no connect 1 en 2 c1+ 3 nc 4 t1 in 5 t2 in 6 t3 in 7 r1 out 8 r2 out 24 c1? 23 sd 22 nc 21 t1 out 20 t2 out 19 t3 out 18 r1 in 17 r2 in 9 r 3 o u t 1 0 r 4 o u t 1 1 r 5 o u t 1 2 n c 1 3 n c 1 4 r 5 i n 1 5 r 4 i n 1 6 r 3 i n 3 2 c 2 ? 3 1 v c c 3 0 c 2 + 2 9 v + 2 8 c 3 + 2 7 g n d 2 6 c 3 ? 2 5 v ? adm3310e/ adm3311e top view (not to scale) 0 2915-006 v+ 1 c2+ 2 v cc 3 c2? 4 c3+ 28 gnd 27 c3? 26 v? 25 en 5 c1+ 6 t1 in 7 c1? 24 sd 23 t1 out 22 t2 in 8 t2 out 21 t3 in 9 t3 out 20 r1 out 10 r1 in 19 r2 out 11 r2 in 18 r3 out 12 r3 in 17 r4 out 13 r4 in 16 r5 out 14 r5 in 15 adm3310e/ adm3311e top view (not to scale) 0 2915-007 figure 6. lfcsp_vq pin configuration figure 7. ssop/tssop pin configuration pin 1 indicator nc = no connect 1 en 2 c1+ 3 nc 4 t 1 in 5 t 2 in 6 t 3 in 7 nc 8 nc 24 c1? 23 sd 22 nc 21 t1 out 20 t2 out 19 t3 out 18 nc 17 nc 9 r 1 o u t 1 0 r 2 o u t 1 1 r 3 o u t 1 2 n c 1 3 n c 1 4 r 3 i n 1 5 r 2 i n 1 6 r 1 i n 3 2 c 2 ? 3 1 v c c 3 0 c 2 + 2 9 v + 2 8 c 3 + 2 7 g n d 2 6 c 3 ? 2 5 v ? adm3312e/ adm3315e top view (not to scale) 0 2915-008 1 2 3 4 5 6 7 8 9 10 20 21 22 23 24 19 18 17 16 15 14 13 12 11 c2+ v cc c2 t1 in c1+ en v+ gnd c3? v? t1 out sd c1? t2 in t3 in r3 out r2 out r1 out t2 out t3 out r3 in r2 in r1 in c3+ adm3312e/ adm3315e top view (not to scale) 02915-009 figure 8. lfcsp_vq pin configuration figure 9. ssop/tssop pin configuration
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 9 of 24 table 4. pin function descriptions mnemonic function v cc power supply input 2.7 v to 3.6 v. v+ internally generated positive supply, 7.25 v (6.5 v nominal for adm3310e, adm3315e). capacitor c4 is connected between v cc and v+. v? internally generated positive supply, ?7.25 v (?6.5 v nominal for adm3310e, adm3315e). capacitor c5 is connected between gnd and v?. gnd ground pin. must be connected to 0 v. c1+, c1? external capacitor 1 is connected between these pins. a 0.1 f capacitor is recommended, but larger capacitors up to 1 f can be used. c2+, c2? external capacitor 2 is connected between these pins. a 0.1 f capacitor is recommended, but larger capacitors up to 1 f can be used. c3+, c3? external capacitor 3 is connected between these pins. a 0.1 f capacitor is recommended, but larger capacitors up to 1 f can be used. t in transmitter (driver) inputs. these inputs accept ttl/cm os levels. an internal 400 k pull-up resistor to v cc is connected on each input. t out transmitter (driver) outputs. typically 5.5 v (6.4 v for adm3311e and adm3312e). r in receiver inputs. these inputs accept rs-232 signal levels. an in ternal 5 k pull-down resistor (22 k for adm3315e) to gnd is connected on each of these inputs. r out receiver outputs. these are ttl/cmos levels. en receiver enable. a high level three-states all the receiver outputs. sd shutdown control. a high level disables the charge pump and reduces the quiescent current to less than 1 a. all transmitters and most receivers are disabled. one receiver remain s active in shutdown (two receivers are active in shutdown for the adm3310e). for adm3307e, r out 3 is active in shutdown. for adm3310e, r out 4 and r out 5 are active in shutdown. for adm3311e, r out 5 is active in shutdown. for adm3312e, r out 3 is active in shutdown. for adm3315e, r out 3 is active in shutdown. nc no connect. table 5. adm3307e truth table sd en status t out 1C5 r out 1C2 r out 3 0 0 normal operation enabled enabled enabled 0 1 normal operation enabled disabled disabled 1 0 shutdown disabled disabled enabled 1 1 shutdown disabled disabled disabled table 6. adm3310e truth table sd en status t out 1C3 r out 1C3 r out 4C5 0 0 normal operation enabled enabled enabled 0 1 receivers disabled enabled disabled disabled 1 0 shutdown disabled disabled enabled 1 1 shutdown disabled disabled disabled table 7. adm3311 truth table sd en status t out 1C3 r out 1C4 r out 5 0 0 normal operation enabled enabled enabled 0 1 receivers disabled enabled disabled disabled 1 0 shutdown disabled disabled enabled 1 1 shutdown disabled disabled disabled table 8. adm3312e/adm3315e truth table sd en status t out 1C3 r out 1C2 r out 3 0 0 normal operation enabled enabled enabled 0 1 normal operation enabled disabled disabled 1 0 shutdown disabled disabled enabled 1 1 shutdown disabled disabled disabled
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 10 of 24 typical performance characteristics v+ sd 02915-010 figure 10. charge pump v+ exiting shutdown sd v? 02915-011 figure 11. charge pump v? exiting shutdown 9 7 5 3 1 ?1 ?3 ?5 ?7 ?9 load current (ma) v+/v? (v) v+ v? 0 5 10 15 20 02915-012 figure 12. charge pump v+ / v? vs. load current (v cc = 3.3 v) 9 7 5 3 1 ?1 ?3 ?5 ?7 load capacitance (pf) tx o/p (v) t out high t out low 0 200 400 600 800 1000 02915-013 figure 13. transmitter outp ut vs. load capacitance (v cc = 3.3 v, data rate = 460 kbps) load capacitance (pf) 40 0 slew rate (v/s) 35 30 25 20 15 10 5 0 2500 2000 1500 1000 500 02915-014 figure 14. slew rate vs. load capacitance (v cc = 3.3 v) 25 20 15 10 5 0 load capacitance (pf) i cc (ma) 0 200 400 600 800 1000 1200 02915-015 figure 15. supply current vs. load capacitance (r l = 3 k) (v cc = 3.3 v, data rate = 460 kbps)
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 11 of 24 25 20 15 10 5 0 load capacitance (pf) i cc (ma) 0 200 400 600 800 1200 1000 02915-016 figure 16. supply current vs. load capacitance (r l = infinite) (v cc = 3.3 v, data rate = 460 kbps) load capacitance (pf) 10 12 supply current (ma) 14 16 18 20 22 24 26 28 30 460kbps 250kbps 125kbps 0 200 400 600 800 1000 0 2915-017 figure 17. supply current vs. load capacitance (v cc = 3.3 v, r l = 5 k) sd tx o/p high 02915-018 figure 18. transmitter output (high) exiting shutdown sd tx o/p low 02915-019 figure 19. transmitter output (low) exiting shutdown 10 8 6 4 2 0 ?2 ?4 ?6 ?8 ?10 load capacitance (pf) tx out voltage (v) 0 200 400 600 800 1000 02915-020 figure 20. transmitter output volt age high/low vs. load capacitance (v cc = 3.3 v, clk = 1 mb/s, r l = 5 k, adm3307e) 300 250 200 150 100 50 0 oscillator frequency (khz) load current (ma) 0 5 10 15 20 0 2915-021 figure 21. oscillator freq uency vs. load current
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 12 of 24 600 500 400 300 200 100 0 v cc (v) i cc (a) 2.62.83.03.23.43.6 0 2915-022 figure 22. i cc vs. v cc (unloaded) 25 20 15 10 5 0 i cc (ma) v cc (v) 2.6 2.8 3.0 3.2 3.4 3.6 02915-023 figure 23. i cc vs. v cc (r l = 3 k)
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 13 of 24 circuit description the internal circuitry consists mainly of four sections. these include the following: ? a charge pump voltage converter ? 3.3 v logic to eia-232 transmitters ? eia-232 to 3.3 v logic receivers ? transient protection circuit on all i/o lines charge pump dc-to-dc voltage converter the charge pump voltage converter consists of a 250 khz (300 khz for adm3307e) oscillator and a switching matrix. the converter generates a 9 v supply from the input 3.0 v level. this is done in two stages using a switched capacitor technique. first, the 3.0 v input supply is tripled to 9.0 v using capacitor c4 as the charge storage element. the +9.0 v level is then inverted to generate ?9.0 v using c5 as the storage element. however, it should be noted that, unlike other charge pump dc- to-dc converters, the charge pump on the adm3307e does not run open-loop. the output voltage is regulated to 7.25 v (or 6.5 v for the adm3310e and adm3315e) by the green idle circuit and never reaches 9 v in practice. this saves power as well as maintains a more constant output voltage. + gnd c2 c1 s1 s2 s3 s4 c4 v cc s5 s6 s7 + + v+ = 3v cc v cc internal oscillator v cc 02915-024 figure 24. charge pump voltage tripler the tripler operates in two phases. during the oscillator low phase, s1 and s2 are closed and c1 charges rapidly to v cc . s3, s4, and s5 are open, and s6 and s7 are closed. during the oscillator high phase, s1 and s2 are open, and s3 and s4 are closed, so the voltage at the output of s3 is 2v cc . this voltage is used to charge c2. in the absence of any discharge current, c2 charges up to 2v cc after several cycles. during the oscillator high phase, as previously mentioned, s6 and s7 are closed, so the voltage at the output of s6 is 3v cc . this voltage is then used to charge c3. the voltage inverter is illustrated in figure 25 . + gnd c3 s8 s9 s10 s11 c5 v? = ?(v+) + gnd v cc internal oscillator from voltage tripler 02915-025 figure 25. charge pump voltage inverter during the oscillator high phase, s10 and s11 are open, while s8 and s9 are closed. c3 is charged to 3v cc from the output of the voltage tripler over several cycles. during the oscillator low phase, s8 and s9 are open, while s10 and s11 are closed. c3 is connected across c5, whose positive terminal is grounded and whose negative terminal is the v? output. over several cycles, c5 charges to ?3 v cc . the v+ and v? supplies may also be used to power external circuitry if the current requirements are small. see figure 12 in the typical performance characteristics section. what is green idle? green idle is a method of minimizing power consumption under idle (no transmit) conditions while still maintaining the ability to transmit data instantly. how does it work? charge pump type dc-to-dc converters used in rs-232 line drivers normally operate open-loop, that is, the output voltage is not regulated in any way. under light load conditions, the output voltage is close to twice the supply voltage for a doubler and three times the supply voltage for a tripler, with very little ripple. as the load current increases, the output voltage falls and the ripple voltage increases. even under no-load conditions, the oscillator and charge pump operate at a very high frequency with consequent switching losses and current drain. green idle works by monitoring the output voltage and maintaining it at a constant value of around 7 v 1 . when the voltage rises above 7.25 v 2 the oscillator is turned off. when the voltage falls below 7 v 1 , the oscillator is turned on and a burst of charging pulses is sent to the reservoir capacitor. when the oscillator is turned off, the power consumption of the charge pump is virtually zero, so the average current drain under light load conditions is greatly reduced. 1 for adm3310e and adm3315e , replace with 6.5 v. 2 for adm3310e and adm3315e , replace with 6.25 v.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 14 of 24 a block diagram of the green idle circuit is shown in figure 26 . both v+ and v? are monitored and compared to a reference voltage derived from an on-chip band gap device. if either v+ or v? fall below 7 v 1 , the oscillator starts up until the voltage rises above 7.25 v 2 . transceivers start/stop start/stop v+ v? shutdown charge pump v? voltage comparator with 250mv hysteresis band gap voltage reference v+ voltage comparator with 250mv hysteresis 02915-026 figure 26. block diagram of green idle circuit the operation of green idle for v+ under various load conditions is illustrated in figure 27 . under light load conditions, c1 is maintained in a charged condition, and only a single oscillator pulse is required to charge up c2. under these conditions, v+ may actually overshoot 7.25 v 2 slightly. osc v+ o v ershoot light load 7.25v 1 7v 2 osc v+ 7.25v 1 7v 2 osc v+ 7.25v 1 7v 2 medium load heavy load 1 for adm3310e and adm3315e replace with 6.5v. 2 for adm3310e and adm3315e replace with 6.25v. 02915-027 figure 27. operation of green idle under various load conditions under medium load conditions, it may take several cycles for c2 to charge up to 7.25 v 2 . the average frequency of the oscillator is higher because there are more pulses in each burst and the bursts of pulses are closer together and more frequent. under high load conditions, the oscillator is on continuously if the charge pump output cannot reach 7.25 v 2 . green idle vs. shutdown shutdown mode minimizes power consumption by shutting down the charge pump altogether. in this mode, the switches in the voltage tripler are configured so v+ is connected directly to v cc . v? is zero because there is no charge pump operation to charge c5. this means there is a delay when coming out of shutdown mode before v+ and v? achieve their normal operating voltages. green idle maintains the transmitter supply voltages under transmitter idle conditions so this delay does not occur. doesnt green idle increase supply voltage ripple? the ripple on the output voltage of a charge pump operating in open-loop depends on three factors: the oscillator frequency, the value of the reservoir capacitor, and the load current. the value of the reservoir capacitor is fixed. increasing the oscillator frequency decreases the ripple voltage; decreasing the oscillator frequency increases it. increasing the load current increases the ripple voltage; decreasing the load current decreases it. the ripple voltage at light loads is naturally lower than that for high load currents. using green idle, the ripple voltage is determined by the high and low thresholds of the green idle circuit. these are nominally 7 v 1 and 7.25 v 2 , so the ripple is 250 mv under most load conditions. with very light load conditions, there may be some overshoot above 7.25 v 2 , so the ripple is slightly greater. under heavy load conditions where the output never reaches 7.25 v 2 , the green idle circuit is inoperative and the ripple voltage is determined by the load current, the same as in a normal charge pump. what about electromagnetic compatibility? green idle does not operate with a constant oscillator frequency. as a result, the frequency and spectrum of the oscillator signal vary with load. any radiated and conducted emissions also vary accordingly. like other analog devices rs-232 transceiver products, the adm33xxe devices feature slew rate limiting and other techniques to minimize radiated and conducted emissions. 1 for adm3310e and adm3315e , replace with 6.5 v. 2 for adm3310e and adm3315e, replace with 6.25 v.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 15 of 24 transmitter (driver) section the drivers convert 3.3 v logic input levels into eia-232 output levels. with v cc = 3.0 v and driving an eia-232 load, the output voltage swing is typically 6.4 v (or 5.5 v for adm3310e and adm3315e). unused inputs may be left unconnected, because an internal 400 kv pull-up resistor pulls them high forcing the outputs into a low state. the input pull-up resistors typically source 8 ma when grounded, so unused inputs should either be connected to v cc or left unconnected in order to minimize power consumption. receiver section the receivers are inverting level shifters that accept rs-232 input levels and translate them into 3.3 v logic output levels. the inputs have internal 5 k pull-down resistors (22 k for the adm3310e) to ground and are also protected against overvoltages of up to 30 v. unconnected inputs are pulled to 0 v by the internal 5 k (or 22 k for the adm3315e) pull- down resistor. this, therefore, results in a logic 1 output level for unconnected inputs or for inputs connected to gnd. the receivers have schmitt trigger inputs with a hysteresis level of 0.14 v. this ensures error-free reception for both noisy inputs and for inputs with slow transition times. enable and shutdown the enable function is intended to facilitate data bus connections where it is desirable to three-state the receiver outputs. in the disabled mode, all receiver outputs are placed in a high impedance state. the shutdown function is intended to shut the device down, thereby minimizing the quiescent current. in shutdown, all transmitters are disabled. all receivers are shut down, except for receiver r3 (adm3307e, adm3312e, and adm3315e), receiver r5 (adm3311e), and receiver r4 and receiver r5 (adm3310e). note that disabled transmitters are not three-stated in shutdown, so it is not permitted to connect multiple (rs-232) driver outputs together. the shutdown feature is very useful in battery-operated systems because it reduces the power consumption to 66 nw. during shutdown, the charge pump is also disabled. when exiting shutdown, the charge pump is restarted and it takes approximately 100 s for it to reach its steady-state operating conditions. 0v 3 v en input t dr v oh ?0.1v v ol +0.1v v oh v ol receiver output 0 2915-028 figure 28. receiver disable timing 3v 0.4v 0v 3 v t er en input v oh v ol receiver output 02915-029 figure 29. receiver enable timing high baud rate the adm33xxe features high slew rates, permitting data transmission at rates well in excess of the eia/rs-232e specifications. rs-232 voltage levels are maintained at data rates up to 230 kbps (460 kbps for adm3307e) under worst-case loading conditions. this allows for high speed data links between two terminals. layout and supply decoupling because of the high frequencies at which the adm33xxe oscillator operates, particular care should be taken with printed circuit board layout, with all traces being as short as possible and c1 to c3 being connected as close to the device as possible. the use of a ground plane under and around the device is also highly recommended. when the oscillator starts up during green idle operation, large current pulses are taken from v cc . for this reason, v cc should be decoupled with a parallel combination of 10 f tantalum and 0.1 f ceramic capacitors, mounted as close to the v cc pin as possible. capacitor c1 to capacitor c3 can have values between 0.1 f and 1 f. larger values give lower ripple. these capacitors can be either electrolytic capacitors chosen for low equivalent series resistance (esr) or nonpolarized types, but the use of ceramic types is highly recommended. if polarized electrolytic capacitors are used, polarity must be observed (as shown by c1+). esd/eft transient protection scheme the adm33xxe uses protective clamping structures on all inputs and outputs that clamp the voltage to a safe level and dissipate the energy present in esd (electrostatic) and eft (electrical fast transients) discharges. a simplified schematic of the protection structure is shown in figure 30 and figure 31 (see figure 32 and figure 33 for adm3307e protection structure). each input and output contains two back-to-back high speed clamping diodes. during normal operation with maximum rs-232 signal levels, the diodes have no effect as one or the other is reverse biased depending on the polarity of the signal. if, however, the voltage exceeds about 50 v, reverse breakdown occurs and the voltage is clamped at this level. the diodes are large p-n junctions designed to handle the instantaneous current surge that can exceed several amperes.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 16 of 24 the transmitter outputs and receiver inputs have a similar protection structure. the receiver inputs can also dissipate some of the energy through the internal 5 k (or 22 k for the adm3310e) resistor to gnd as well as through the protection diodes. r in rx d1 d2 receiver input 02915-030 figure 30. receiver input protection scheme tx d1 d2 transmitter output 02915-031 figure 31. transmitter output protection scheme the adm3307e protection scheme is slightly different (see figure 32 and figure 33 ). the receiver inputs, transmitter inputs, and transmitter outputs contain two back-to-back high speed clamping diodes. the receiver outputs (cmos outputs), the sd and en pins, contain a single reverse biased high speed clamping diode. under normal operation with maximum cmos signal levels, the receiver output, sd, and en protection diodes have no effect because they are reversed biased. if, however, the voltage exceeds about 15 v, reverse breakdown occurs and the voltage is clamped at this level. if the voltage reaches ?0.7 v, the diode is forward biased and the voltage is clamped at this level. the receiver inputs can also dissipate some of the energy through the internal 5 k resistor to gnd as well as through the protection diodes. r in d1 d3 d2 receiver input receiver output rx 02915-032 figure 32. adm3307e receiver input protection scheme d1 d2 d3 d4 transmitter output transmitter input tx 02915-033 figure 33. adm3307e transmitter output protection scheme the protection structures achieve esd protection up to 15 kv on all rs-232 i/o lines (and all cmos lines, including sd and en for the adm3307e). for methods used to test the protection scheme, see the esd testing (iec 1000-4-2) section. esd testing (iec 1000-4-2) iec 1000-4-2 (previously 801-2) specifies compliance testing using two coupling methods, contact discharge and air-gap discharge. contact discharge calls for a direct connection to the unit being tested. airgap discharge uses a higher test voltage but does not make direct contact with the unit under testing. with air discharge, the discharge gun is moved toward the unit under testing, which develops an arc across the air gap, thus the term air discharge. this method is influenced by humidity, temperature, barometric pressure, distance, and rate of closure of the discharge gun. the contact discharge method, while less realistic, is more repeatable and is gaining acceptance in preference to the air-gap method. although very little energy is contained within an esd pulse, the extremely fast rise time coupled with high voltages can cause failures in unprotected semiconductors. catastrophic destruction can occur immediately as a result of arcing or heating. even if catastrophic failure does not occur immediately, the device can suffer from parametric degradation that can result in degraded performance. the cumulative effects of continuous exposure can eventually lead to complete failure. i/o lines are particularly vulnerable to esd damage. simply touching or plugging in an i/o cable can result in a static discharge that can damage or completely destroy the interface product connected to the i/o port. traditional esd test methods, such as the mil-std-883b method 3015.7, do not fully test a products susceptibility to this type of discharge. this test was intended to test a products susceptibility to esd damage during handling. each pin is tested with respect to all other pins. there are some important differences between the traditional test and the iec test. ? the iec test is much more stringent in terms of discharge energy. the peak current injected is over four times greater. ? the current rise time is significantly faster in the iec test. ? the iec test is carried out while power is applied to the device. it is possible that the esd discharge could induce latch-up in the device under test. this test, therefore, is more representative of a real world i/o discharge where the equipment is operating normally with power applied. for maximum peace of mind, however, both tests should be performed, ensuring maximum protection both during handling and later during field service.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 17 of 24 r1 c1 esd test method r2 c1 iec1000-4-2 1.5kv 100pf human body model esd assoc. std 55.1 330v 150pf device under test high voltage generator r2 02915-034 figure 34. esd test standards 100 90 36.8 10 time t t dl t rl i peak (%) 0 2915-035 figure 35. human body model esd current waveform 100 90 10 time t 30ns 60ns 0.1ns to 1ns i peak (%) 02915-036 figure 36. iec1000-4-2 esd current waveform the adm33xxe devices are tested using both of the previously mentioned test methods. all pins are tested with respect to all other pins as per the human body model, esd assoc. std. 55.1 specification. in addition, all i/o pins are tested as per the iec 1000-4-2 test specification. the products were tested under the following conditions: ? power-onnormal operation ? power-off there are four levels of compliance defined by iec 1000-4-2. the adm33xxe parts meet the most stringent compliance level for both contact and air-gap discharge. this means the products are able to withstand contact discharges in excess of 8 kv and airgap discharges in excess of 15 kv. table 9. iec 1000-4-2 compliance levels level contact discharge kv air discharge kv 1 2 2 2 4 4 3 6 8 4 8 15
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 18 of 24 outline dimensions compliant to jedec standards mo-220-vhhd-2 0.30 0.23 0.18 0.20 ref 0.80 max 0.65 typ 0.05 max 0.02 nom 12 max 1.00 0.85 0.80 seating plane coplanarity 0.08 1 32 8 9 25 24 16 17 0.50 0.40 0.30 3.50 ref 0.50 bsc pin 1 indicator top view 5.00 bsc sq 4.75 bsc sq 3.25 3.10 sq 2.95 pin 1 indicator 0.60 max 0.60 max 0.25 min exposed pad (bottom view) figure 37. 32-lead lead frame chip scale package [lfcsp_vq] 5 mm x 5 mm body, very thin quad (cp-32-2) dimensions shown in millimeters 0.25 0.09 0.95 0.75 0.55 8 4 0 0.05 min 1.85 1.75 1.65 2.00 max 0.38 0.22 seating plane 0.65 bsc coplanarity 0.10 28 15 14 1 10.50 10.20 9.90 5.60 5.30 5.00 8.20 7.80 7.40 pin 1 compliant to jedec standards mo-150-ah figure 38. 28-lead shrink small outline package [ssop] (rs-28) dimensions shown in millimeters
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 19 of 24 24 13 12 1 6.40 bsc 4.50 4.40 4.30 pin 1 7.90 7.80 7.70 0.15 0.05 0.30 0.19 0.65 bsc 1.20 max 0.20 0.09 0.75 0.60 0.45 8 0 seating plane 0.10 coplanarity compliant to jedec standards mo-153-ad figure 39. 24-lead thin shrink small outline package [tssop] (ru-24) dimensions shown in millimeters compliant to jedec standards mo-153-ae 28 15 14 1 8 0 seating plane c oplanarit y 0.10 1.20 max 6.40 bsc 0.65 bsc pin 1 0.30 0.19 0.20 0.09 4.50 4.40 4.30 0.75 0.60 0.45 9.80 9.70 9.60 0.15 0.05 figure 40. 28-lead thin shrink small outline package [tssop] (ru-28) dimensions shown in millimeters
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 20 of 24 ordering guide model temperature range package description package option adm3307earu ?40c to +85c 28-lead thin shrink small outline [tssop] ru-28 adm3307earu-reel ?40c to +85c 28-lead tape and reel ru-28 adm3307earu-reel7 ?40c to +85c 28-lead tape and reel ru-28 adm3307earuz 1 ?40c to +85c 28-lead thin shrink small outline [tssop] ru-28 ADM3307EARUZ-REEL 1 ?40c to +85c 28-lead tape and reel ru-28 ADM3307EARUZ-REEL7 1 ?40c to +85c 28-lead tape and reel ru-28 adm3307eacp ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3307eacp-reel ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3307eacp-reel7 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3307eacpz 1 ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3307eacpz-reel 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3307eacpz-reel7 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3310earu ?40c to +85c 28-lead thin shrink small outline [tssop] ru-28 adm3310earu-reel ?40c to +85c 28-lead tssop tape and reel ru-28 adm3310earu-reel7 ?40c to +85c 28-lead tssop tape and reel ru-28 adm3310earuz 1 ?40c to +85c 28-lead thin shrink small outline [tssop] ru-28 adm3310earuz-reel 1 ?40c to +85c 28-lead tssop tape and reel ru-28 adm3310earuz-reel7 1 ?40c to +85c 28-lead tssop tape and reel ru-28 adm3310eacp ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3310eacp-reel ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3310eacp-reel7 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3310eacpz 1 ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3310eacpz-reel 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3310eacpz-reel7 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3311ears ?40c to +85c 28-lead shrink small outline [ssop] rs-28 adm3311ears-reel ?40c to +85c 28-lead ssop tape and reel rs-28 adm3311ears-reel7 ?40c to +85c 28-lead ssop tape and reel rs-28 adm3311earsz 1 ?40c to +85c 28-lead shrink small outline [ssop] rs-28 adm3311earsz-reel 1 ?40c to +85c 28-lead ssop tape and reel rs-28 adm3311earsz-reel7 1 ?40c to +85c 28-lead ssop tape and reel rs-28 adm3311earu ?40c to +85c 28-lead thin shrink small outline [tssop] ru-28 adm3311earu-reel ?40c to +85c 28-lead tssop tape and reel ru-28 adm3311earu-reel7 ?40c to +85c 28-lead tssop tape and reel ru-28 adm3311earuz 1 ?40c to +85c 28-lead thin shrink small outline [tssop] ru-28 adm3311earuz-reel 1 ?40c to +85c 28-lead tssop tape and reel ru-28 adm3311earuz-reel7 1 ?40c to +85c 28-lead tssop tape and reel ru-28 adm3311eacp ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3311eacp-reel ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3311eacp-reel7 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3311eacpz 1 ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3311eacpz-reel 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3311eacpz-reel7 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3312earu ?40c to +85c 24-lead thin shrink small outline [tssop] ru-24 adm3312earu-reel ?40c to +85c 24-lead tssop tape and reel ru-24 adm3312earu-reel7 ?40c to +85c 24-lead tssop tape and reel ru-24 adm3312earuz 1 ?40c to +85c 24-lead thin shrink small outline [tssop] ru-24 adm3312earuz-reel 1 ?40c to +85c 24-lead tssop tape and reel ru-24 adm3312earuz-reel7 1 ?40c to +85c 24-lead tssop tape and reel ru-24 adm3312eacp ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3312eacp-reel ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3312eacp-reel7 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 21 of 24 model temperature range package description package option adm3312eacpz 1 ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3312eacpz-reel 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3312eacpz-reel7 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3315earu ?40c to +85c 24-lead thin shrink small outline [tssop] ru-24 adm3315earu-reel ?40c to +85c 24-lead tssop tape and reel ru-24 adm3315earu-reel7 ?40c to +85c 24-lead tssop tape and reel ru-24 adm3315earuz 1 ?40c to +85c 24-lead thin shrink small outline [tssop] ru-24 adm3315earuz-reel 1 ?40c to +85c 24-lead tssop tape and reel ru-24 adm3315earuz-reel7 1 ?40c to +85c 24-lead tssop tape and reel ru-24 adm3315eacp ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3315eacp-reel ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3315eacp-reel7 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3315eacpz 1 ?40c to +85c 32-lead lead frame chip scale package [lfcsp_vq] cp-32-2 adm3315eacpz-reel 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 adm3315eacpz-reel7 1 ?40c to +85c 32-lead lfcsp_vq tape and reel cp-32-2 1 z = pb-free part.
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 22 of 24 notes
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 23 of 24 notes
adm3307e/adm3310e/adm3311e/adm3312e/adm3315e rev. h | page 24 of 24 notes ?2006 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. c 02915-0-1/06(h)

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